Carbon nanofibers added to adhesives show promise for meeting electrostatic dissipation (ESD) and thermal management requirements of future space missions.
Adhesive formulations containing varying percentages and types of carbon nanofibers show property enhancements that promise to meet future space mission ESD and thermal management requirements. The addition of carbon nanofibers improves the thermal properties of adhesives, but it is not sufficient to meet the needs for waste heat removal at the bonded interfaces of radiator components.
Graph top left: Thermal conductivity and resistivity as a function of nanofiber loading. Resistivity decreased as nanofiber loading increased up to 16 weight %, while the thermal conductivity also increased over the same range.
Graph top right: Viscosity profile of adhesive formulas. Viscosities of adhesive formulas at or below the viscosity of the baseline formulation (Eccobond 56C/catalyst 9 resin) were considered acceptable.
Table bottom left: Double lap shear testing of nano adhesive (EA 9396). Double lap shear testing of M55J/996 composite-to-metal and metal-to-metal adherends was conducted for the EA9396 adhesive formulations with 4% and 8% weight of carbon nanofiber filler concentrations.
Table bottom right: Thermal conductivity results. It is clear that the addition of carbon nanofibers to adhesives provided comparable thermal conductivity to the commercially available Masterbond adhesive.
To improve the thermal and electrical conductivity of adhesives, PPI recommends the following products XXX